Application Bonding conditions: The adhesive substrate and ambient temperature should ideally be between 18?C and 20?C. The moisture content of wood materials should be uniform and should be between 8% and 12%. Do not process below 15?C. Spreading: SIAbond D4 can be applied by serrated glue spreader, roller, brush or by spray. Application is normally to one surface at a rate of 150g/m? when applied manually, 100g/m? when applied by machine, depending on the substrate. Double sided application is recommended for hard woods. Open assembly times: Maximum of 4-7 minutes depending on the materials to be bonded. Assembly times are dependant on ambient conditions and substrates used. Pressing: Pressure must be applied whilst the adhesive is still wet. 0.2 – 0.4 N/mm? for flat bonding, 0.7 – 1.0 N/mm? for laminating and chip board bonding. Technical Data Colour: White, clear when dry Viscosity: Medium Specific gravity: approx. 1.06 g/cm? pH: approx. 3 Open Time: 4-7 minutes @ 20?C Chalk point: approx. 10?C Cleaning Equipment should be cleaned with warm or cold water whilst the adhesive is still wet. Storage and Shelf Life The adhesive should be stored in a cool, dry area at temperatures between 5?C and 30?C. Under these conditions the product has a shelf life of 6 months when stored in the original, unopened container. DO NOT ALLOW THE PRODUCT TO FREEZE
